Senior Thermal Engineer, DCGAP Thermal Mechanical
Engineering
THE ROLE:
As a Senior Thermal Engineer in the Data Center and GPU
Accelerated Processing (DCGAP) Thermal Mechanical Engineering department, you
will be responsible for the thermal design, validation and technology
development for the AMD Data Center GPU products in this expanding and
strategic market for AMD. To accomplish
this, you will need to interact with other key engineering teams such as
silicon design, boarding engineering, validation, and manufacturing and leaders
within AMD, our customers, and our partners.
THE PERSON:
The Senior Thermal Engineer in the Thermal Mechanical
Engineering team will have excellent communication skills, planning skills,
technical expertise, is a team player, possesses critical problem solving and
troubleshooting skills, is a self-starter, and is well organized. They will be
market savvy and comfortable in a fast paced, multi-tasking environment.
KEY RESPONSIBILITIES:
The Senior Thermal Engineer in the Thermal Mechanical
Engineering team will be responsible for the end-to-end development and
delivery of thermal and/or mechanical solutions for the GPU and associated
platforms. The successful candidate will have a thermal and mechanical
development background with silicon level or system level experience. They will
integrate into a global development team in delivering commercially viable
products (silicon to systems) to the marketplace in a timely and cost-effective
manner.
Some of the key responsibilities will include
• Design
thermal solutions to enable AMD's next generation of Datacenter GPUs
• Collaborate
with board engineering, power engineering and other cross-functional teams to
design thermal-mechanical solutions from chip to system level
• Contribute
to the overall product cycle from conceptualization through mass production
• Work
in a dynamic and fast-paced product development environment
• Thermal
validation of thermal-mechanical hardware at chip, card and system level
• Investigate
novel thermal technologies and work with vendors to productize it
• Drive
process improvements while executing fast time-to-market on products.
PREFERRED EXPERIENCE:
The selected candidate will use his/her proven technical
skills to ensure the engineering team continuously innovates, uses ‘best
practices’, and adds value for its customers. Key qualifications required
include
• Strong
background in heat transfer and fluid dynamics with emphasis on electronics
thermal management
• CFD/
FEA - Experience with Icepak and/or Flotherm is required. FEA experience in
ANSYS is a plus.
• CAD -
Experience with SolidWorks and/or Creo is required.
• Datacenter
and server level design experience
• Lab
Skills - Experience with Design of Experiments, instrumentation, data
acquisition and data analysis, including uncertainty analysis.
• Excellent
verbal and written communication skills at the engineering and executive
levels, including a proven track record of working across organization
boundaries to define requirements, solve complex problems and drive programs to
successful completion
• Manufacturing
- Good knowledge of Design for Manufacturing, including experience with volume
manufacturing in Asia as well as North America
• Experience
with engineering statistical analysis methods
ACADEMIC CREDENTIALS:
BS 8+ yrs in Mechanical Engineering or applied physics is
preferred. Any speculation in related
field is advantageous. An advanced
Engineering degree would be an added plus.